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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9824899 B1

PDFFull Text
Date of Patent:
Nov. 21, 2017

Filed:

Dec. 16, 2014

Etching liquid for oxide containing zinc and tin, and etching method

Applicant:

Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;

Inventors:

Mari Shigeta, Tokyo, JP;

Kunio Yube, Tokyo, JP;

Assignee:

MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Marvin Payen

Assistant Examiner:

Jeremy Joy

Int. Cl.
CPC ...
H01L 21/465 (2006.01); H01L 21/02 (2006.01); H01L 21/4757 (2006.01); H01L 21/3213 (2006.01); H01L 29/786 (2006.01); H01L 31/18 (2006.01); H01L 29/66 (2006.01); C09K 13/00 (2006.01); C09K 13/06 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 21/465 (2013.01); C09K 13/00 (2013.01); C09K 13/06 (2013.01); H01L 21/02554 (2013.01); H01L 21/02565 (2013.01); H01L 21/32134 (2013.01); H01L 21/47573 (2013.01); H01L 27/1225 (2013.01); H01L 27/1259 (2013.01); H01L 29/66 (2013.01); H01L 29/7869 (2013.01); H01L 31/1888 (2013.01); H01L 29/66969 (2013.01); Y02E 10/50 (2013.01);
Abstract

The present invention provides an etching liquid which has a suitable etching rate for etching of an oxide containing zinc and tin and is suppressed in change of the etching rate due to dissolution of the oxide, while being free from the generation of a precipitate. The corrosiveness of this etching liquid to wiring materials is low enough to be ignored, and this etching liquid has excellent linearity of a pattern shape. The present invention uses an etching liquid which contains (A) one or more substances selected from the group consisting of sulfuric acid, nitric acid, hydrochloric acid, methanesulfonic acid, perchloric acid and salts of these acids, and (B) oxalic acid or a salt thereof and water, and which has a pH of from −1 to 1.

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