The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2017
Filed:
May. 10, 2013
Applicant:
Ebara Corporation, Tokyo, JP;
Inventors:
Yu Ishii, Tokyo, JP;
Kenya Ito, Tokyo, JP;
Shozo Takahashi, Kanagawa, JP;
Mika Suzuki, Kanagawa, JP;
Assignee:
EBARA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/005 (2012.01); B24B 37/10 (2012.01); B24B 37/30 (2012.01); B24B 37/04 (2012.01); B24B 37/24 (2012.01);
U.S. Cl.
CPC ...
B24B 37/005 (2013.01); B24B 37/042 (2013.01); B24B 37/10 (2013.01); B24B 37/24 (2013.01); B24B 37/30 (2013.01);
Abstract
A polishing pad for polishing a workpiece to a mirror finish is attached to a rotatable polishing table of a chemical mechanical polishing apparatus. The workpiece, such as a metal body, is held by a carrier and pressed against the polishing pad. This polishing pad includes: an elastic pad having a polishing surface; a deformable base layer that supports the elastic pad; and an adhesive layer that joins the elastic pad to the base layer.
Ishii, Yu. (2017). Polishing pad and chemical mechanical polishing apparatus for polishing a workpiece, and method of polishing a workpiece using the chemical mechanical polishing apparatus (U.S. Patent No. 9821429). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9821429
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile