The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2017
Filed:
Dec. 04, 2014
Ams Ag, Unterpremstaetten, AT;
AMS AG, Unterpremstaetten, AT;
Abstract
The interposer-chip-arrangement comprises an interposer (), metal layers arranged above a main surface (), a further metal layer arranged above a further main surface () opposite the main surface, an electrically conductive interconnection () through the interposer, the interconnection connecting one of the metal layers and the further metal layer, a chip () arranged at the main surface or at the further main surface, the chip having a contact pad (), which is electrically conductively connected with the interconnection, a dielectric layer () arranged above the main surface with the metal layers embedded in the dielectric layer, a further dielectric layer () arranged above the further main surface with the further metal layer embedded in the further dielectric layer, and an integrated circuit () in the interposer, the integrated circuit being connected with at least one of the metal layers ().