The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2017

Filed:

Oct. 17, 2016
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Yi-Ruei Lin, Taipei, TW;

Yen-Ming Peng, Taoyuan County, TW;

Han-Wei Yang, Hsinchu, TW;

Chen-Chung Lai, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/532 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3192 (2013.01); H01L 21/76801 (2013.01); H01L 21/76808 (2013.01); H01L 21/76822 (2013.01); H01L 21/76877 (2013.01); H01L 23/3171 (2013.01); H01L 23/3178 (2013.01); H01L 23/481 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 23/53295 (2013.01); H01L 23/562 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A semiconductor device structure and a method of fabricating the same are provided. The semiconductor device structure includes a gate structure embedded in a first dielectric layer over a substrate and a second dielectric layer formed over the first dielectric layer. The semiconductor device structure includes a conductive feature formed in the second dielectric layer over the gate structure and a first structure formed at least two sides of the conductive feature in the second dielectric layer. The first dielectric layer is made of a compressive material and the first structure is made of a tensile material or wherein the first dielectric layer is made of a compressive material and the first structure is made of a tensile material.


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