The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2017

Filed:

Jan. 29, 2015
Applicant:

Hitachi Kokusai Electric Inc., Tokyo, JP;

Inventors:

Hideto Tateno, Toyama, JP;

Yuichi Wada, Toyama, JP;

Hiroshi Ashihara, Toyama, JP;

Keishin Yamazaki, Toyama, JP;

Takurou Ushida, Toyama, JP;

Iwao Nakamura, Toyama, JP;

Manabu Izumi, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/40 (2006.01); H01L 21/67 (2006.01); C23C 16/455 (2006.01); C23C 16/46 (2006.01); C23C 16/52 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C23C 16/402 (2013.01); C23C 16/45561 (2013.01); C23C 16/46 (2013.01); C23C 16/52 (2013.01); H01L 21/02164 (2013.01); H01L 21/02222 (2013.01); H01L 21/02238 (2013.01); H01L 21/02282 (2013.01); H01L 21/02326 (2013.01); H01L 21/02337 (2013.01); H01L 21/67017 (2013.01); H01L 21/67109 (2013.01); H01L 21/67115 (2013.01); H01L 21/67248 (2013.01);
Abstract

A substrate processing apparatus is disclosed. The substrate processing apparatus includes a process chamber configured to accommodate a substrate; a gas supply unit configured to supply a process gas into the process chamber; a lid member configured to block an end portion opening of the process chamber; an end portion heating unit installed around a side wall of an end portion of the process chamber; and a thermal conductor installed on a surface of the lid member in an inner side of the process chamber, and configured to be heated by the end portion heating unit.


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