The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2017
Filed:
Sep. 19, 2013
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 19/03 (2006.01); B23K 35/26 (2006.01); B23K 35/30 (2006.01); B23K 35/36 (2006.01); B23K 35/40 (2006.01); B23K 35/02 (2006.01); B23K 35/22 (2006.01); C22C 13/00 (2006.01); C22F 1/00 (2006.01); C22F 1/10 (2006.01); B22F 1/00 (2006.01); B22F 1/02 (2006.01); B22F 9/08 (2006.01); B23K 1/00 (2006.01); C22C 13/02 (2006.01); C22C 19/00 (2006.01); C22C 19/05 (2006.01); C22C 30/04 (2006.01);
U.S. Cl.
CPC ...
C22C 19/03 (2013.01); B22F 1/0011 (2013.01); B22F 1/0048 (2013.01); B22F 1/025 (2013.01); B22F 9/082 (2013.01); B23K 1/0016 (2013.01); B23K 35/025 (2013.01); B23K 35/0222 (2013.01); B23K 35/0244 (2013.01); B23K 35/22 (2013.01); B23K 35/262 (2013.01); B23K 35/30 (2013.01); B23K 35/3033 (2013.01); B23K 35/36 (2013.01); B23K 35/40 (2013.01); C22C 13/00 (2013.01); C22C 13/02 (2013.01); C22C 19/00 (2013.01); C22C 19/058 (2013.01); C22C 30/04 (2013.01); C22F 1/00 (2013.01); C22F 1/10 (2013.01); B22F 2009/0824 (2013.01); B22F 2009/0848 (2013.01); B22F 2301/15 (2013.01); B22F 2301/30 (2013.01); B22F 2304/10 (2013.01); B22F 2304/15 (2013.01);
Abstract
To provide a Ni ball having a low α dose and high sphericity even when it contains impurity elements other than Ni in certain amounts. The Ni ball contains an element U, a content thereof being 5 ppb or less, and an element Th, a content thereof being 5 ppb or less, wherein a purity of the Ni ball is 99.9% or more but 99.995% or less, an α dose thereof is 0.0200 cph/cmor less, a content of either Pb or Bi, or a total content of both Pb and Bi is 1 ppm or more, and a sphericity thereof is 0.90 or more, in order to prevent any software errors and reduce connection failure.