The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2017
Filed:
Sep. 06, 2016
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Sinan Goktepeli, San Diego, CA (US);
Steve Fanelli, San Marcos, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 29/786 (2006.01); H01L 29/06 (2006.01); H01L 23/522 (2006.01); H01L 23/66 (2006.01); H01L 21/762 (2006.01); H01Q 1/38 (2006.01); H01Q 1/24 (2006.01);
U.S. Cl.
CPC ...
H01L 29/78615 (2013.01); H01L 21/76251 (2013.01); H01L 23/5223 (2013.01); H01L 23/66 (2013.01); H01L 29/0649 (2013.01); H01Q 1/241 (2013.01); H01Q 1/38 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01);
Abstract
An integrated circuit may include a gate, having gate fingers. The integrated circuit may also include a body, having semiconductor pillars interlocking with the gate fingers of the gate. The integrated circuit may also include a backside contact(s) coupled to the body. The integrated circuit may further include a backside metallization. The backside metallization may be coupled to the body through the backside contact(s).