The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2017
Filed:
Dec. 23, 2014
Applicant:
Amkor Technology, Inc., Tempe, AZ (US);
Inventors:
Ronald Patrick Huemoeller, Gilbert, AZ (US);
Sukianto Rusli, Phoenix, AZ (US);
David Jon Hiner, Chandler, AZ (US);
Assignee:
AMKOR TECHNOLOGY, INC., Tempe, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 23/31 (2013.01); H01L 23/552 (2013.01); H01L 24/14 (2013.01); H01L 24/30 (2013.01);
Abstract
An encapsulated semiconductor package. As non-limiting examples, various aspects of the present disclosure provide an integrated circuit package comprising a laminate, an integrated circuit die coupled to the laminate, an encapsulant surrounding at least top and side surface of the integrated circuit die, a conductive column extending from the top side of the integrated circuit die to a top side of the encapsulant, and a signal distribution structure on a top side of the encapsulant.