The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2017
Filed:
Mar. 22, 2017
Xilinx, Inc., San Jose, CA (US);
Gamal Refai-Ahmed, Santa Clara, CA (US);
Suresh Ramalingam, Fremont, CA (US);
Brian D. Philofsky, Longmont, CO (US);
XILINIX, INC., San Jose, CA (US);
Abstract
Methods and apparatus are described for heat management in an integrated circuit (IC) package using a device with a textured surface having multiple grooves in an otherwise relatively flat surface. The textured surface of the heat management device is designed, in conjunction with a thermal interface material (TIM), to push gas bubbles out of the flat areas such that the gas bubbles are trapped in the grooves or driven out of the interface between the device and the TIM altogether. The area of the grooves is small relative to the ungrooved areas (i.e., the flat areas), such that when the gas bubbles are trapped in the grooved areas, the ungrooved areas work even better for heat transfer. With the area of the regions for the flat portions being substantially greater than the area of the regions for the grooves, the textured heat management device is designed to lower thermal resistance, increase thermal conductivity, and increase heat transfer from one or more IC dies to a heat sink assembly in an IC package.