The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2017

Filed:

Jun. 22, 2015
Applicant:

Rensselaer Polytechnic Institute, Troy, NY (US);

Inventors:

Rajendra P. Dahal, Troy, NY (US);

Ishwara B. Bhat, Clifton Park, NY (US);

Yaron Danon, Selkirk, NY (US);

James Jian-Qiang Lu, Watervliet, NY (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); G01T 1/24 (2006.01); G01T 3/08 (2006.01); H01L 31/115 (2006.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
G01T 1/24 (2013.01); G01T 3/08 (2013.01); H01L 31/115 (2013.01); H01L 31/18 (2013.01);
Abstract

Methods for fabricating radiation-detecting structures are presented. The methods include, for instance: fabricating a radiation-detecting structure, the fabricating including: providing a semiconductor substrate, the semiconductor substrate having a plurality of cavities extending into the semiconductor substrate from a surface thereof; and electrophoretically depositing radiation-detecting particles of a radiation-detecting material into the plurality of cavities extending into the semiconductor substrate, where the electrophoretically depositing fills the plurality of cavities with the radiation-detecting particles. In one embodiment, the providing can include electrochemically etching the semiconductor substrate to form the plurality of cavities extending into the semiconductor substrate. In addition, the providing can further include patterning the surface of the semiconductor substrate with a plurality of surface defect areas, and the electrochemically etching can include using the plurality of surface defect areas to facilitate electrochemically etching into the semiconductor substrate through the plurality of surface defect areas to form the plurality of cavities.


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