The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 07, 2017

Filed:

Aug. 27, 2014
Applicant:

Kulicke & Soffa Industries, Inc., Fort Washington, PA (US);

Inventors:

Deepak Sood, New Britain, PA (US);

Zhijie Wang, Chalfont, PA (US);

Thomas J. Colosimo, Jr., West Chester, PA (US);

David A. Rauth, Riverton, NJ (US);

Shu-Guo Tang, Chalfont, PA (US);

Assignee:

Kulicke & Soffa Industries, Inc., Fort Washington, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/95 (2006.01); G01N 21/88 (2006.01); H01L 21/66 (2006.01); G06T 7/00 (2017.01); G01N 21/84 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G01N 21/9501 (2013.01); G01N 21/8422 (2013.01); G01N 21/8806 (2013.01); G06T 7/0006 (2013.01); H01L 22/12 (2013.01); H01L 24/75 (2013.01); H01L 24/83 (2013.01); G01N 2021/8812 (2013.01); G01N 2021/8829 (2013.01); G06T 2207/10152 (2013.01); G06T 2207/30148 (2013.01); H01L 24/16 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/92 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2731 (2013.01); H01L 2224/29012 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/75901 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83908 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/3512 (2013.01);
Abstract

A method of determining a physical characteristic of an adhesive material on a semiconductor device element using structured light is provided. The method includes the steps of: (1) applying a structured light pattern to an adhesive material on a semiconductor device element; (2) creating an image of the structured light pattern using a camera; and (3) analyzing the image of the structured light pattern to determine a physical characteristic of the adhesive material. Additional methods and systems for determining physical characteristics of semiconductor devices and elements using structured light are also provided.


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