The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9809883 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 07, 2017

Filed:

Jul. 10, 2015
Applicant:

Rohm and Haas Electronic Materials Llc, Marlborough, MA (US);

Inventors:

Andy Lok-Fung Chow, Fanling, CN;

Dennis Kwok-Wai Yee, Fanling, CN;

Crystal P. L. Li, Fanling, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/02 (2006.01); C23C 18/40 (2006.01); C09D 1/00 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
C23C 18/40 (2013.01); C09D 1/00 (2013.01); H05K 3/187 (2013.01); H01B 1/02 (2013.01);
Abstract

The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates.


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Chow, Andy Lok-Fung. (2017). Formaldehyde free electroless copper plating compositions and methods (U.S. Patent No. 9809883). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9809883

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