The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2017
Filed:
Apr. 17, 2013
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Hikaru Nomura, Saitama, JP;
Shunsaku Yoshikawa, Tokyo, JP;
Assignee:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); C22C 13/00 (2006.01); B23K 35/28 (2006.01); B23K 1/00 (2006.01); B23K 101/38 (2006.01); B23K 1/19 (2006.01); B23K 101/32 (2006.01); B23K 103/10 (2006.01); B23K 101/00 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 1/00 (2013.01); B23K 1/0016 (2013.01); B23K 1/19 (2013.01); B23K 35/282 (2013.01); C22C 13/00 (2013.01); B23K 2201/00 (2013.01); B23K 2201/32 (2013.01); B23K 2201/38 (2013.01); B23K 2203/10 (2013.01); Y10T 403/479 (2015.01);
Abstract
A solder alloy has an alloy composition containing Zn of 3 through 25 mass %, Ti of 0.002 through 0.25 mass %, Al of 0.002 through 0.25 mass % and balance of Sn, a solder joint made of the solder alloy, and a jointing method using the solder alloy.