The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2017

Filed:

May. 19, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Shaowu Huang, Steilacoom, WA (US);

Hanqiao Zhang, DuPont, WA (US);

Kai Xiao, University Place, WA (US);

Beom-Taek Lee, Mountain View, CA (US);

John J. Abbott, Dupont, WA (US);

Gary Charles, Austin, TX (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 3/08 (2006.01); H04B 3/32 (2006.01); H05K 1/02 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H01P 3/081 (2013.01); H04B 3/32 (2013.01); H05K 1/02 (2013.01); H05K 9/0022 (2013.01);
Abstract

Apparatuses and methods associated with shield lines, and/or complementary decoupling capacitors and/or electromagnetic absorbing materials are disclosed herein. In embodiments, an apparatus may include a substrate having a ground plane; and a first and a second transmission line disposed on the substrate. Further, the apparatus may include a shield line constituted with electromagnetic absorbing material disposed between the first and second transmission lines and not coupled with the ground plane. In embodiments, the substrate may further include a power plane having a plurality of edges and a plurality of spacing; a plurality of decoupling capacitors disposed on the power or ground plane; and electromagnetic absorbing materials adhered to the plurality of edges and disposed in the plurality of spacing. Other embodiments may be described and/or claimed.


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