The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2017
Filed:
Jan. 23, 2013
Dawei Xing, Singapore, SG;
Jie Liu, Singapore, SG;
Hong Wei Guan, Singapore, SG;
Yue Gen Yu, Singapore, SG;
Seow Kiang Khoo, Singapore, SG;
Dawei Xing, Singapore, SG;
Jie Liu, Singapore, SG;
Hong Wei Guan, Singapore, SG;
Yue Gen Yu, Singapore, SG;
Seow Kiang Khoo, Singapore, SG;
ASM TECHNOLOGY SINGAPORE PTE LTD, Singapore, SG;
Abstract
Disclosed is a method of manufacturing a lead frame, which comprises the steps of: providing an electrically-conductive base material having first and second planar sides; forming a plurality of conductive contact points on the first planar side of the base material; providing a non-conductive filling material over the first planar side of the base material so that the filling material fills spaces in-between the plurality of contact points to a form a layer comprising the filling material and the plurality of contact points; and etching the second planar side of the base material to expose a pattern of the filling material from the second planar side of the base material and to thereby form a plurality of isolated conductive regions on the second planar side of the base material, each isolated conductive region being connected with at least a respective one of the plurality of contact points on the first planar side of the base material. A lead frame structure is also disclosed.