The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2017

Filed:

Feb. 25, 2014
Applicant:

National Technology & Engineering Solutions of Sandia, Llc, Albuquerque, NM (US);

Inventors:

David Bruce Robinson, Hayward, CA (US);

Patrick J. Cappillino, Fremont, CA (US);

Leah B. Sheridan, Knoxville, TN (US);

John L. Stickney, Athens, GA (US);

David M. Benson, Athens, GA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 8/02 (2006.01); C23C 8/06 (2006.01); C23C 22/78 (2006.01); C23C 18/44 (2006.01); C23C 28/00 (2006.01); C23C 18/18 (2006.01); C23C 16/02 (2006.01);
U.S. Cl.
CPC ...
C23C 28/00 (2013.01); C23C 8/02 (2013.01); C23C 8/06 (2013.01); C23C 16/02 (2013.01); C23C 18/1834 (2013.01); C23C 18/44 (2013.01);
Abstract

A method of electroless atomic layer deposition is described. The method electrolessly generates a layer of sacrificial material on a surface of a first material. The method adds doses of a solution of a second material to the substrate. The method performs a galvanic exchange reaction to oxidize away the layer of the sacrificial material and deposit a layer of the second material on the surface of the first material. The method can be repeated for a plurality of iterations in order to deposit a desired thickness of the second material on the surface of the first material.


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