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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9803161 B1

PDFFull Text
Date of Patent:
Oct. 31, 2017

Filed:

Apr. 26, 2013

Cleaning agent for semiconductor substrates and method for processing semiconductor substrate surface

Applicant:

Wako Pure Chemical Industries, Ltd., Osaka-shi, Osaka, JP;

Inventors:

Hiromi Kawada, Kawagoe, JP;

Hironori Mizuta, Kawagoe, JP;

Tsuneaki Maesawa, Kawagoe, JP;

Assignee:

WAKO PURE CHEMICAL INDUSTRIES, LTD., Osaka-shi, JP;

Attorney:

Westerman, Hattori, Daniels & Adrian, LLP

Primary Examiner:

Gregory Webb

Int. Cl.
CPC ...
C11D 7/50 (2006.01); C11D 11/00 (2006.01); C11D 7/36 (2006.01); H01L 21/02 (2006.01); C11D 7/32 (2006.01); H01L 21/768 (2006.01); H01L 21/3105 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
C11D 11/0047 (2013.01); C11D 7/3218 (2013.01); C11D 7/36 (2013.01); H01L 21/0206 (2013.01); H01L 21/02068 (2013.01); H01L 21/02074 (2013.01); H01L 21/31055 (2013.01); H01L 21/3212 (2013.01); H01L 21/7684 (2013.01);
Abstract

A cleaning agent is provided for a semiconductor substrate superior in corrosion resistance of a tungsten wiring or a tungsten alloy wiring, and superior in removal property of polishing fines (particle) such as silica or alumina, remaining at surface of the semiconductor substrate, in particular, at surface of a silicon oxide film such as a TEOS film, after a chemical mechanical polishing process; and a method for processing a semiconductor substrate surface. A cleaning agent for a semiconductor substrate is to be used in a post process of a chemical mechanical polishing process of the semiconductor substrate having a tungsten wiring or a tungsten alloy wiring, and a silicon oxide film, comprising (A) a phosphonic acid-based chelating agent, (B) a primary or secondary monoamine having at least one alkyl group or hydroxyalkyl group in a molecule and (C) water, wherein a pH is over 6 and below 7.

Find Patent Forward Citations

Kawada, Hiromi. (2017). Cleaning agent for semiconductor substrates and method for processing semiconductor substrate surface (U.S. Patent No. 9803161). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9803161

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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