The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2017
Filed:
Sep. 21, 2015
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81C 1/00 (2006.01); H01L 29/84 (2006.01); B81B 3/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00269 (2013.01); B81B 7/00 (2013.01); B81B 7/0041 (2013.01); B81B 7/0051 (2013.01); B81C 1/00 (2013.01); B81C 1/00325 (2013.01); B81B 3/007 (2013.01); B81B 3/0018 (2013.01); B81B 3/0067 (2013.01); B81B 7/0006 (2013.01); B81B 7/0016 (2013.01); B81B 7/0029 (2013.01); B81B 7/0058 (2013.01); B81B 2201/025 (2013.01); B81B 2201/0228 (2013.01); B81B 2201/0235 (2013.01); B81B 2207/07 (2013.01); B81B 2207/096 (2013.01); B81C 1/00293 (2013.01); B81C 2203/0118 (2013.01);
Abstract
A microelectromechanical system (MEMS) device may include a MEMS structure above a first substrate. The MEMS structure comprising a central static element, a movable element, and an outer static element. A portion of bonding material between the central static element and the first substrate. A second substrate above the MEMS structure, with a portion of a dielectric layer between the central static element and the second substrate. A supporting post comprises the portion of bonding material, the central static element, and the portion of dielectric material.