The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2017

Filed:

Jun. 27, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventor:

Douglas G. Bennett, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 35/24 (2006.01); H01L 51/52 (2006.01); H01L 51/56 (2006.01); H05K 1/02 (2006.01); H05K 3/32 (2006.01); H01R 4/48 (2006.01); H01R 12/57 (2011.01);
U.S. Cl.
CPC ...
H01L 51/52 (2013.01); H01L 51/56 (2013.01); H01R 4/48 (2013.01); H01R 12/57 (2013.01); H05K 1/0215 (2013.01); H05K 3/325 (2013.01); H05K 2201/0311 (2013.01);
Abstract

Generally, this disclosure provides systems, devices and methods for improved electrical coupling of multiple ground planes of a device. The device may include a plurality of ground planes and an electrically conductive ground clip. The ground clip may include a base portion configured to secure the ground clip to the device and a plurality of spring fingers. Each of the spring fingers may be configured to contact and electrically couple to one of the plurality of ground planes, wherein the ground clip is to provide a conduction path between each of the spring fingers. One of the spring fingers may pass through an opening or cut-through in a first ground plane to contact a second ground plane. The device may be a mobile communication or computing platform.


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