The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2017

Filed:

Mar. 31, 2017
Applicant:

X-celeprint Limited, Cork, IE;

Inventors:

Christopher Bower, Raleigh, NC (US);

Matthew Meitl, Durham, NC (US);

David Gomez, Holly Springs, NC (US);

Carl Prevatte, Jr., Raleigh, NC (US);

Salvatore Bonafede, Chapel Hill, NC (US);

Assignee:

X-Celeprint Limited, Lee Maltings, Dyke Parade, Cork, IE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 21/46 (2006.01); H01L 21/00 (2006.01); H01L 33/00 (2010.01); H01L 33/62 (2010.01); H01L 33/36 (2010.01); H01L 33/44 (2010.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 33/0079 (2013.01); H01L 21/6835 (2013.01); H01L 33/007 (2013.01); H01L 33/36 (2013.01); H01L 33/44 (2013.01); H01L 33/62 (2013.01); H01L 2221/68322 (2013.01); H01L 2221/68381 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0033 (2013.01);
Abstract

The present invention provides structures and methods that enable the construction of micro-LED chiplets formed on a sapphire substrate that can be micro-transfer printed. Such printed structures enable low-cost, high-performance arrays of electrically connected micro-LEDs useful, for example, in display systems. Furthermore, in an embodiment, the electrical contacts for printed LEDs are electrically interconnected in a single set of process steps. In certain embodiments, formation of the printable micro devices begins while the semiconductor structure remains on a substrate. After partially forming the printable micro devices, a handle substrate is attached to the system opposite the substrate such that the system is secured to the handle substrate. The substrate may then be removed and formation of the semiconductor structures is completed. Upon completion, the printable micro devices may be micro transfer printed to a destination substrate.


Find Patent Forward Citations

Loading…