The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2017

Filed:

Jun. 23, 2015
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Tzu-Yi Yang, Taipei, TW;

Kuo-Ji Chen, Wu-Ku, TW;

Chien-Yuan Lee, Zhubei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/02 (2006.01); H01L 27/088 (2006.01); H01L 27/06 (2006.01); H01L 23/528 (2006.01); H01L 49/02 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0288 (2013.01); H01L 23/528 (2013.01); H01L 27/0629 (2013.01); H01L 27/0886 (2013.01); H01L 28/20 (2013.01); H01L 29/785 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A FinFET device includes a plurality of FinFET devices formed on a corresponding plurality of fins in a multilevel interconnect semiconductor device. Each source and each drain is coupled to a metal interconnect level by a metal resistive element that is subjacent the lowermost interconnect level. In one embodiment, a metal segment extending over a plurality of the fins includes contacts to each of the fins, thereby providing subjacent metal resistive elements of different lengths. The plurality of fins and subjacent metal segments are arranged such that each of the FinFET devices has the same total resistance provided by the source and drain metal resistive elements, even though the source metal resistive element and drain metal resistive element associated with the fins may have different lengths. The arrangement provides the same turn-on resistance and the same ESD failure current for each FinFET device.


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