The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2017

Filed:

Nov. 25, 2016
Applicant:

Vanguard International Semiconductor Corporation, Hsinchu, TW;

Inventors:

Yu-Lung Chin, Tainan, TW;

Shin-Cheng Lin, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 29/20 (2006.01); H01L 29/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0254 (2013.01); H01L 21/02617 (2013.01); H01L 21/02634 (2013.01); H01L 21/02639 (2013.01); H01L 21/02645 (2013.01); H01L 29/2003 (2013.01); H01L 29/32 (2013.01); H01L 21/0262 (2013.01); H01L 21/02631 (2013.01);
Abstract

A semiconductor substrate structure includes a seed layer on a substrate, a first gallium nitride layer on the seed layer, and a patterned first hard mask layer on the first gallium nitride layer, wherein the patterned first hard mask layer includes a first opening. The semiconductor substrate structure also includes a second gallium nitride layer in the first opening and on the patterned first hard mask layer, a patterned second hard mask layer on the second gallium nitride layer, wherein the patterned second hard mask layer includes a second opening, and at least a portion of a projection on the substrate of the first opening and a projection on the substrate of the second opening are non-overlapped. The semiconductor substrate structure further includes a third gallium nitride layer in the second opening and on the patterned second hard mask layer.


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