The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2017
Filed:
Mar. 04, 2013
Applicant:
Fujimi Incorporated, Kiyosu-shi, Aichi, JP;
Inventors:
Masayuki Serikawa, Kiyosu, JP;
Tomomi Akiyama, Kiyosu, JP;
Assignee:
FUJIMI INCORPORATED, Kiyosu-Shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); H01L 21/302 (2006.01); H01L 21/02 (2006.01); B24B 37/04 (2012.01); H01L 21/306 (2006.01); H01L 29/16 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); B24B 37/044 (2013.01); H01L 21/02024 (2013.01); H01L 21/302 (2013.01); H01L 21/30625 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01);
Abstract
A polishing composition contains abrasive grains and water. 50% by mass or more of the abrasive grains consists of particles A having particle sizes between 40 nm and 80 nm inclusive, and 10% by mass or more of the abrasive grains consists of particles B having particle sizes between 150 nm and 300 nm inclusive. The polishing composition is used to polish a surface of a compound semiconductor substrate.
Serikawa, Masayuki. (2017). Polishing composition and method using said polishing composition to manufacture compound semiconductor substrate (U.S. Patent No. 9796881). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9796881
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile