The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2017
Filed:
Jul. 12, 2012
Applicants:
Simon Sebanz, Leoben, AT;
Hannes Voraberger, Graz, AT;
Inventors:
Simon Sebanz, Leoben, AT;
Hannes Voraberger, Graz, AT;
Assignee:
AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT, Loeben-Hinterberg, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 3/10 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/02 (2013.01); H05K 3/0055 (2013.01); H05K 3/4691 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/2072 (2013.01); H05K 2203/1461 (2013.01); Y10T 29/49155 (2015.01);
Abstract
A method of manufacturing a printed circuit board or a sub-assembly thereof by coupling at least two elements of insulating materials with different properties on adjacent side surfaces and covering the elements with a layer of conductive material and building up at least one further layer at least partly overlapping the at least two elements.