The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2017

Filed:

Nov. 25, 2014
Applicant:

Epistar Corporation, Hsinchu, TW;

Inventors:

Chia-Liang Hsu, Hsinchu, TW;

Han-Min Wu, Hsinchu, TW;

Ye-Ming Hsu, Hsinchu, TW;

Chien-Fu Huang, Hsinchu, TW;

Tzu-Chieh Hsu, Hsinchu, TW;

Min-Hsun Hsieh, Hsinchu, TW;

Assignee:

Epistar Corporation, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/50 (2010.01); H01L 27/15 (2006.01); H01L 33/56 (2010.01); H01L 33/54 (2010.01); H01L 33/60 (2010.01); F21V 8/00 (2006.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); G02B 6/0031 (2013.01); G02B 6/0073 (2013.01); H01L 33/50 (2013.01); H01L 33/507 (2013.01); H01L 33/54 (2013.01); H01L 33/60 (2013.01); G02B 6/0025 (2013.01); H01L 33/48 (2013.01); H01L 33/486 (2013.01); H01L 2224/48091 (2013.01);
Abstract

An encapsulated light-emitting diode device is disclosed. The encapsulated light-emitting diode device includes a circuit carrier including a surface; a light-emitting device including a transparent substrate, the transparent substrate including a first surface and a second surface, and the first surface and the surface of the circuit carrier includes an included angle larger than zero; a light-emitting diode chip located on the first surface of the transparent substrate; and a first transparent glue covering the light-emitting diode chip and formed on the first surface; and a second transparent glue formed on the second surface corresponding to the first transparent glue; wherein the first transparent glue has a circular projection on the first surface and the light-emitting diode chip is substantially located at the center of the circular projection.


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