The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2017

Filed:

Nov. 02, 2016
Applicant:

Renesas Electronics Corporation, Koutou-ku, Tokyo, JP;

Inventors:

Akira Matsumoto, Tokyo, JP;

Yoshinao Miura, Tokyo, JP;

Yasutaka Nakashiba, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 23/495 (2006.01); H01L 27/088 (2006.01); H01L 27/02 (2006.01); H01L 29/417 (2006.01); H01L 23/485 (2006.01); H01L 23/50 (2006.01); H01L 23/492 (2006.01); H01L 23/00 (2006.01); H01L 27/06 (2006.01); H01L 29/423 (2006.01); H01L 29/78 (2006.01); H01L 29/778 (2006.01); H01L 29/20 (2006.01); H01L 23/482 (2006.01); H01L 29/205 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49562 (2013.01); H01L 23/485 (2013.01); H01L 23/4824 (2013.01); H01L 23/492 (2013.01); H01L 23/4952 (2013.01); H01L 23/49503 (2013.01); H01L 23/49548 (2013.01); H01L 23/49575 (2013.01); H01L 23/50 (2013.01); H01L 23/528 (2013.01); H01L 23/5283 (2013.01); H01L 24/06 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 27/0203 (2013.01); H01L 27/0605 (2013.01); H01L 27/088 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01); H01L 29/41758 (2013.01); H01L 29/4236 (2013.01); H01L 29/7786 (2013.01); H01L 29/7787 (2013.01); H01L 29/78 (2013.01); H01L 24/45 (2013.01); H01L 29/1066 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06051 (2013.01); H01L 2224/451 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/4805 (2013.01); H01L 2224/4813 (2013.01); H01L 2224/48177 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49113 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10344 (2013.01); H01L 2924/13064 (2013.01); H01L 2924/30101 (2013.01);
Abstract

Disclosed is a semiconductor device in which a resistance component resulting from wiring is reduced. A plurality of transistor units are arranged side by side in a first direction, each of which has a plurality of transistors. The gate electrodes of the transistors extend in the first direction. First source wiring extends between first transistor unit and second transistor unit, and first drain wiring extends between the second transistor unit and third transistor unit. Second drain wiring extends on the side of the first transistor unit opposite to the side where the first source wiring extends, and second source wiring extends on the side of the third transistor unit opposite to the side where the second drain wiring extends.


Find Patent Forward Citations

Quick Actions:

Matsumoto, Akira. (2017). Semiconductor device (U.S. Patent No. 9793196). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9793196

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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