The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2017
Filed:
Jun. 24, 2014
Applicant:
Amkor Technology, Inc., Chandler, AZ (US);
Inventors:
Seo Yeon Ahn, Gyeonggi-do, KR;
Doo Hyun Park, Gyeonggi-do, KR;
Pil Je Sung, Seoul, KR;
Won Chul Do, Gyeonggi-do, KR;
Young Rae Kim, Gyeonggi-do, KR;
Seung Chul Han, Gyeonggi-do, KR;
Joo Hyun Kim, Chungcheongnam-do, KR;
Jong Sik Paek, Incheon, KR;
Assignee:
AMKOR TECHNOLOGY, INC., Tempe, AZ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 21/66 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 22/14 (2013.01); H01L 21/78 (2013.01); H01L 22/22 (2013.01); H01L 24/14 (2013.01); H01L 24/32 (2013.01); H01L 24/92 (2013.01); H01L 24/97 (2013.01); H01L 21/561 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81001 (2013.01); H01L 2224/81908 (2013.01); H01L 2224/83001 (2013.01); H01L 2224/839 (2013.01); H01L 2224/83951 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/37001 (2013.01);
Abstract
A semiconductor device and manufacturing method thereof. Various aspects of the disclosure may, for example, comprise connection verification for a first one or more mounted components prior to additional assembly.