The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2017

Filed:

May. 09, 2016
Applicant:

Kemet Electronics Corporation, Simpsonville, SC (US);

Inventors:

John E. McConnell, Simpsonville, SC (US);

Garry L. Renner, Simpsonville, SC (US);

John Bultitude, Simpsonville, SC (US);

Assignee:

KEMET Electronics Corporation, Simpsonville, SC (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/00 (2006.01); H01G 9/07 (2006.01); H01G 9/008 (2006.01); H01G 9/045 (2006.01); B23K 1/00 (2006.01); B23K 1/005 (2006.01); B23K 1/008 (2006.01); B23K 1/20 (2006.01); B23K 35/36 (2006.01); B23K 35/02 (2006.01); H01G 4/30 (2006.01); H01G 4/005 (2006.01); H01G 4/232 (2006.01); B23K 35/28 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H01G 9/0032 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); B23K 1/0053 (2013.01); B23K 1/203 (2013.01); B23K 35/0227 (2013.01); B23K 35/286 (2013.01); B23K 35/3613 (2013.01); H01G 4/005 (2013.01); H01G 4/2325 (2013.01); H01G 4/30 (2013.01); H01G 9/008 (2013.01); H01G 9/0029 (2013.01); H01G 9/045 (2013.01); H01G 9/07 (2013.01); B23K 2201/42 (2013.01); H01L 2224/83825 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/1461 (2013.01); Y10T 29/435 (2015.01);
Abstract

An improved method for forming a capacitor is provided as is a capacitor, or electrical component, formed by the method. The method includes providing an aluminum containing anode with an aluminum oxide dielectric thereon; forming a cathode on a first portion of the aluminum oxide dielectric; bonding an anode lead to the aluminum anode on a second portion of the aluminum oxide by a transient liquid phase sintered conductive material thereby metallurgical bonding the aluminum anode to the anode lead; and bonding a cathode lead to said cathode.


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