The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2017

Filed:

Apr. 04, 2013
Applicant:

Smartrac Ip B.v., Amsterdam, NL;

Inventors:

Martin Kuschewski, Marktoberdorf, DE;

Manfred Rietzler, Marktoberdorf, DE;

Assignee:

SMARTRAC I.P. B.V., Amsterdam, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/07 (2006.01); G06K 19/077 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07754 (2013.01); G06K 19/0775 (2013.01); G06K 19/07722 (2013.01); H01L 24/81 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/8185 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81201 (2013.01); H01L 2224/81224 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/141 (2013.01);
Abstract

The invention relates to a transponder layer (), in particular for producing a chip card, having an antenna substrate (), which, on an antenna side (), is equipped with an antenna () formed from a wire conductor (), and has a chip accommodation which is formed by a recess in the antenna substrate and in which a chip () is accommodated, wherein wire conductor ends, which serve to form terminal ends () of the antenna, are formed at a bottom () of the chip accommodation which is recessed with respect to the rear side () of the antenna substrate (), and the chip is accommodated in the chip accommodation in such a manner that terminal contacts () arranged on a contact side () of the chip are contacted with flat contact portions () of the terminal ends (), and the chip is arranged with the rear side () of its semiconductor body () facing the terminal contacts substantially flush with the rear side of the antenna substrate. Furthermore, the invention relates to a method for producing a transponder layer.


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