The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2017

Filed:

Feb. 28, 2014
Applicant:

Korea Institute of Machinery & Materials, Daejeon, KR;

Inventors:

Jun-Hyuk Choi, Daejeon, KR;

Eung-Sug Lee, Changwon-si, KR;

Ji-Hye Lee, Daejeon, KR;

Jun-ho Jeong, Daejeon, KR;

Joo-Yun Jung, Daejeon, KR;

Dae-Guen Choi, Daejeon, KR;

Cheol-Hyeon Kim, Daejeon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/10 (2006.01); B32B 37/12 (2006.01); B29C 65/48 (2006.01); G02B 5/00 (2006.01); B32B 37/06 (2006.01); B44C 1/24 (2006.01); G09F 3/10 (2006.01); B82Y 20/00 (2011.01);
U.S. Cl.
CPC ...
G02B 5/008 (2013.01); B32B 37/06 (2013.01); B82Y 20/00 (2013.01); G09F 3/10 (2013.01); Y10T 156/1031 (2015.01); Y10T 156/1041 (2015.01);
Abstract

In a method for fabricating an embedded pattern using a transfer-based imprinting, an adhesive layer is formed on a substrate. The adhesive layer has a photo curable resin. A stamp having a protruded pattern is prepared. A thin-film layer is formed on an outer surface of the protruded pattern of the stamp. The stamp having the thin-film layer contact with the adhesive layer is pressed to selectively transfer the thin-film layer of the protruded pattern to the adhesive layer. Ultraviolet rays (UV) are irradiated to cure the adhesive layer. The stamp is removed.


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