The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2017
Filed:
Mar. 24, 2014
Applicant:
Newsouth Innovations Pty Limited, Sydney, AU;
Assignee:
NEWSOUTH INNOVATIONS PTY LIMITED, Sydney, AU;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01); H01L 31/18 (2006.01); H01L 31/0216 (2014.01); H01L 31/0224 (2006.01); C25D 11/32 (2006.01); C25D 11/02 (2006.01); C25D 11/06 (2006.01); C25D 17/06 (2006.01); H01L 31/0236 (2006.01); C25D 11/00 (2006.01);
U.S. Cl.
CPC ...
H01L 31/1868 (2013.01); C25D 11/005 (2013.01); C25D 11/022 (2013.01); C25D 11/06 (2013.01); C25D 11/32 (2013.01); C25D 17/06 (2013.01); H01L 31/0236 (2013.01); H01L 31/02167 (2013.01); H01L 31/022425 (2013.01); Y02E 10/50 (2013.01); Y02P 70/521 (2015.11);
Abstract
The present disclosure provides a method of anodizing a surface of a semiconductor device comprising a p-n junction. The method comprises exposing a first surface portion of the semiconductor device to an electrolytic solution that is suitable for anodizing the first surface portion when an electrical current is directed through a region at the first surface portion. Further, the method comprises exposing a portion of the semiconductor device to electromagnetic radiation in a manner such that the electromagnetic radiation induces the electrical current and the first surface portion anodizes.