The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2017

Filed:

Oct. 11, 2016
Applicant:

Chi-hsing Hsu, New Taipei, TW;

Inventor:

Chi-Hsing Hsu, New Taipei, TW;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 25/04 (2014.01);
U.S. Cl.
CPC ...
H01L 27/14634 (2013.01); H01L 25/042 (2013.01); H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); H01L 27/14636 (2013.01); H01L 27/14643 (2013.01);
Abstract

A portable electronic device and an image capturing module thereof are disclosed. The image capturing module includes a circuit substrate, a structure reinforcing frame, a plurality of image sensing chips, an adhesive body, and a plurality of lens modules. The circuit substrate has a plurality of first passing openings. The structure reinforcing frame is disposed on the circuit substrate, and the structure reinforcing frame has a plurality of second passing openings respectively communicated with the first passing openings. The image sensing chips is electrically connected with the circuit substrate by wire bonding, and the image sensing chips are coplanarly disposed on a datum plane. The adhesive body is connected between each image sensing chip and the structure reinforcing frame. The lens modules are disposed on the circuit substrate, and the lens modules respectively correspond to the image sensing chips.


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