The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2017

Filed:

Sep. 15, 2015
Applicants:

Rouying Zhan, Gilbert, AZ (US);

Chai Ean Gill, Chandler, AZ (US);

Changsoo Hong, Phoenix, AZ (US);

Michael H. Kaneshiro, Chandler, AZ (US);

Inventors:

Rouying Zhan, Gilbert, AZ (US);

Chai Ean Gill, Chandler, AZ (US);

Changsoo Hong, Phoenix, AZ (US);

Michael H. Kaneshiro, Chandler, AZ (US);

Assignee:

NXP USA, INC., Austin, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/74 (2006.01); H01L 29/747 (2006.01); H01L 29/00 (2006.01); H01L 21/331 (2006.01); H01L 27/082 (2006.01); H01L 29/73 (2006.01); H01L 27/02 (2006.01); H01L 29/66 (2006.01); H01L 23/60 (2006.01); H01L 29/06 (2006.01); H01L 29/08 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0259 (2013.01); H01L 23/60 (2013.01); H01L 27/0248 (2013.01); H01L 27/0262 (2013.01); H01L 27/082 (2013.01); H01L 29/0649 (2013.01); H01L 29/0808 (2013.01); H01L 29/0821 (2013.01); H01L 29/1008 (2013.01); H01L 29/6625 (2013.01); H01L 29/66234 (2013.01); H01L 29/73 (2013.01); H01L 29/7317 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An ESD protection device is fabricated in a semiconductor substrate that includes a semiconductor layer having a first conductivity type. A first well implantation procedure implants dopant of a second conductivity type in the semiconductor layer to form inner and outer sinker regions. The inner sinker region is configured to establish a common collector region of first and second bipolar transistor devices. A second well implantation procedure implants dopant of the first conductivity type in the semiconductor layer to form respective base regions of the first and second bipolar transistor devices. Conduction of the first bipolar transistor device is triggered by breakdown between the inner sinker region and the base region of the first bipolar transistor device. Conduction of the second bipolar transistor device is triggered by breakdown between the outer sinker region and the base region of the second bipolar transistor device.


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