The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2017
Filed:
Dec. 11, 2014
Applicant:
SK Hynix Inc., Gyeonggi-do, KR;
Inventors:
Eun-Jeong Kim, Gyeonggi-do, KR;
Jin-Yul Lee, Gyeonggi-do, KR;
Assignee:
SK Hynix Inc., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 23/528 (2006.01); H01L 21/764 (2006.01); H01L 23/532 (2006.01); H01L 23/535 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/528 (2013.01); H01L 21/764 (2013.01); H01L 23/5222 (2013.01); H01L 23/535 (2013.01); H01L 23/5329 (2013.01); H01L 27/10814 (2013.01); H01L 27/10823 (2013.01); H01L 27/10852 (2013.01); H01L 27/10876 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A semiconductor device includes: a first plug; a bit line which is in contact with the first plug and over the first plug and extended in one direction; a second plug including a first part adjacent to the bit line and a second part adjacent to the first plug; a double air gap which is disposed between the first part of the second plug and the bit line and includes a first air gap surrounding the first part of the second plug and a second air gap parallel to sidewalls of the bit line; and a capping layer suitable for capping the first and second air gaps.