The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2017

Filed:

Nov. 07, 2008
Applicants:

Hiroshi Matsutani, Hitachi, JP;

Takumi Ueno, Hitachi, JP;

Alexandre Nicolas, Hitachi, JP;

Ken Nanaumi, Chikusei, JP;

Inventors:

Hiroshi Matsutani, Hitachi, JP;

Takumi Ueno, Hitachi, JP;

Alexandre Nicolas, Hitachi, JP;

Ken Nanaumi, Chikusei, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/30 (2006.01); G03F 7/20 (2006.01); G03F 7/004 (2006.01); H01L 23/31 (2006.01); G03F 7/023 (2006.01); G03F 7/40 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3171 (2013.01); G03F 7/0236 (2013.01); G03F 7/40 (2013.01); H01L 23/3114 (2013.01); H01L 24/13 (2013.01); H01L 2224/05001 (2013.01); H01L 2224/056 (2013.01); H01L 2224/05008 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/05024 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05572 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/181 (2013.01); Y10T 428/24479 (2015.01);
Abstract

A positive-type photosensitive resin composition includes (A) a phenol resin modified by a compound having an unsaturated hydrocarbon group having 4 to 100 carbon atoms; (B) a compound that produces an acid by light; (C) a thermal crosslinking agent; and (D) a solvent. The positive-type photosensitive resin composition according to the present invention can be developed by an alkaline aqueous solution, and an effect thereof is that a resist pattern having sufficiently high sensitivity and resolution, excellent adhesion, and good thermal shock resistance can be formed.


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