The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2017

Filed:

Apr. 11, 2016
Applicant:

Asm Technology Singapore Pte Ltd, Singapore, SG;

Inventor:
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/82 (2006.01); H01L 21/268 (2006.01); B23K 26/067 (2006.01); B23K 26/082 (2014.01); B23K 26/364 (2014.01); B23K 26/38 (2014.01); B23K 26/0622 (2014.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); B23K 26/0622 (2015.10); B23K 26/0676 (2013.01); B23K 26/082 (2015.10); B23K 26/364 (2015.10); B23K 26/38 (2013.01); H01L 21/268 (2013.01); B23K 2201/40 (2013.01);
Abstract

A method is described of radiatively cutting a wafer, the method comprising the steps of low power cutting of two trenches followed by high power cutting of a fissure. A single pulsed radiation beam is split into a first pulsed radiation beam for cutting at least one of the trenches and a second pulsed radiation beam for cutting the fissure. When cutting a fissure on the wafer in a cutting direction along a cutting street, the first and second radiation beams are directed simultaneously with the first radiation beam leading and the second radiation beam trailing. For cutting a fissure in the opposite cutting direction, a third pulsed radiation beam for trenching is split from said single pulsed radiation beam.


Find Patent Forward Citations

Loading…