logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9786541 B1

PDFFull Text
Date of Patent:
Oct. 10, 2017

Filed:

Sep. 27, 2012

Dicing sheet with protective film forming layer and chip fabrication method

Applicant:

Lintec Corporation, Tokyo, JP;

Inventors:

Tomonori Shinoda, Tokyo, JP;

Masaaki Furudate, Tokyo, JP;

Ken Takano, Tokyo, JP;

Assignee:

LINTEC Corporation, Tokyo, JP;

Attorney:

Cahn & Samuels, LLP

Primary Examiner:

Anish Desai

Int. Cl.
CPC ...
B32B 7/12 (2006.01); H01L 21/683 (2006.01); H01L 21/304 (2006.01); H01L 21/78 (2006.01); C09J 7/02 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); C09J 7/0225 (2013.01); H01L 21/304 (2013.01); H01L 21/78 (2013.01); H01L 23/544 (2013.01); C09J 2201/622 (2013.01); C09J 2203/326 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68377 (2013.01); H01L 2223/54406 (2013.01); H01L 2223/54433 (2013.01); H01L 2223/54486 (2013.01); H01L 2924/0002 (2013.01); Y10T 428/24843 (2015.01);
Abstract

A dicing sheet with a protective film forming layer has a substrate film, an adhesive layer, and a protective film forming layer, and at a minimum, the adhesive layer is formed in an area surrounding the protective film forming layer in a planar view, and the substrate film has the following characteristics (a)-(c): (a) the melting point either exceeds 130° C. or the film has no melting point; (b) the thermal contraction rate under conditions of heating at 130° C. for two hours is from −5 to +5%, and (c) the degree of elongation-to-break in the MD direction and the CD direction is at least 100%, and the stress at 25% is no more than 100 MPa.

Find Patent Forward Citations

Shinoda, Tomonori. (2017). Dicing sheet with protective film forming layer and chip fabrication method (U.S. Patent No. 9786541). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9786541

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…