The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2017

Filed:

Sep. 03, 2014
Applicant:

Cadence Design Systems, Inc., San Jose, CA (US);

Inventors:

Alok Tripathi, Uttar Pradesh, IN;

An-yu Kuo, San Jose, CA (US);

Bradley Brim, Rainer, WA (US);

Taranjit Singh Kukal, Delhi, IN;

Assignee:

Cadence Design Systems, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); G05B 19/418 (2006.01);
U.S. Cl.
CPC ...
G05B 19/418 (2013.01); G06F 17/5063 (2013.01); G06F 17/5068 (2013.01); G06F 2217/74 (2013.01); G06F 2217/80 (2013.01); G06F 2217/82 (2013.01); Y02P 90/26 (2015.11); Y02P 90/265 (2015.11);
Abstract

Disclosed are methods and systems for by identifying or generating an electrical schematic, generating a thermal schematic by associating thermal RC circuits of the electronic design with the electrical schematic, performing at least two analyses of an electrical analysis, a thermal analysis, and an electromagnetic interference compliance (EMC) analysis with the electrical schematic and the thermal schematic of the electronic design. The electrical, thermal, and EMC analyses may be performed concurrently by forwarding intermediate or final analysis results to each other, and the analysis results may be presented simultaneously in one or more user interface windows. The thermal schematic may be obtained by extracting the thermal RC circuits, identifying corresponding electrical circuit components that correspond to the extracted thermal RC circuits, and importing the thermal RC circuits into the electrical schematic so that the electrical and thermal schematics have the same nodes.


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