The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2017

Filed:

Apr. 08, 2016
Applicant:

Cascade Microtech, Inc., Beaverton, OR (US);

Inventors:

Michael Teich, Moritzburg, DE;

Karsten Stoll, Sohland an der Spree, DE;

Walter Matthias Clauss, Radeberg, DE;

Swen Schmiedchen, Dresden, DE;

Assignee:

Cascade Microtech, Inc., Beaverton, OR (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/10 (2006.01); G01R 1/18 (2006.01); G01R 1/067 (2006.01); G01R 1/44 (2006.01); G01R 1/073 (2006.01); G01N 27/42 (2006.01); G01N 31/02 (2006.01);
U.S. Cl.
CPC ...
G01R 1/18 (2013.01); G01R 1/06711 (2013.01); G01R 1/07392 (2013.01); G01R 1/44 (2013.01); G01N 27/42 (2013.01); G01N 31/02 (2013.01);
Abstract

Shielded probe systems are disclosed herein. The shielded probe systems are configured to test a device under test (DUT) and include an enclosure that defines an enclosure volume, a translation stage with a stage surface, a substrate-supporting stack extending from the stage surface, an electrically conductive shielding structure, an isolation structure, and a thermal shielding structure. The substrate-supporting stack includes an electrically conductive support surface and a temperature-controlled chuck. The electrically conductive shielding structure defines a shielded volume. The isolation structure electrically isolates the electrically conductive shielding structure from the enclosure and from the translation stage. The thermal shielding structure extends within the enclosure volume and at least partially between the enclosure and the substrate-supporting stack.


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