The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2017

Filed:

Dec. 06, 2013
Applicant:

Rohm and Haas Electronic Materials Llc, Marlborough, MA (US);

Inventors:

Julia Kozhukh, Cambridge, MA (US);

Zuhra I. Niazimbetova, Westborough, MA (US);

Maria Anna Rzeznik, Shrewsbury, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/38 (2006.01); C25D 3/32 (2006.01); C07D 403/12 (2006.01); C07D 403/14 (2006.01); C07D 239/48 (2006.01); C25D 3/58 (2006.01); C25D 3/60 (2006.01); C25D 7/12 (2006.01); C25D 5/02 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
C25D 3/32 (2013.01); C07D 239/48 (2013.01); C07D 403/12 (2013.01); C07D 403/14 (2013.01); C25D 3/38 (2013.01); C25D 3/58 (2013.01); C25D 3/60 (2013.01); C25D 5/02 (2013.01); C25D 7/123 (2013.01); H05K 3/423 (2013.01);
Abstract

Reaction products of halogenated pyrimidines and nucleophilic linker units are included in metal electroplating baths to provide good throwing power. The electroplating baths can be used to plate metal, such as copper, tin and alloys thereof on printed circuit boards and semiconductors and fill through-holes and vias.


Find Patent Forward Citations

Loading…