The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2017

Filed:

Nov. 11, 2015
Applicant:

Ibiden Co., Ltd., Ogaki-shi, JP;

Inventors:

Naoyuki Nagaya, Ibi-gun, JP;

Kiyotaka Tsukada, Ibi-gun, JP;

Assignee:

IBIDEN CO., LTD., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 3/34 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/341 (2013.01); H05K 1/0206 (2013.01); H05K 3/005 (2013.01); H05K 2201/091 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10416 (2013.01); Y02P 70/613 (2015.11);
Abstract

A substrate for mounting an electronic component includes a base material including insulating resin, a first conductor layer formed on first surface of the material, a second conductor layer formed on second surface of the material, and a metal block inserted into a hole penetrating through the first conductor, material and second conductor such that the metal block is fitted in the hole. The material has a bent portion in contact with the metal block in the hole such that the bent portion is bending toward the second conductor, the metal block has surface on first conductor side such that the surface has an outer peripheral portion having a curved-surface shape, and the hole has a first fitting inlet on the first conductor layer side and a second fitting inlet on second conductor side and that the metal block is positioned in contact with the second fitting inlet.


Find Patent Forward Citations

Loading…