The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2017

Filed:

Mar. 18, 2014
Applicants:

National University Corporation Nagaoka University of Technology, Nagaoka-shi, JP;

Lintec Corporation, Itabashi-ku, JP;

Inventors:

Masatoshi Takeda, Nagaoka, JP;

Tsuyoshi Mutou, Saitama, JP;

Takeshi Kondo, Saitama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 35/28 (2006.01); H01L 35/32 (2006.01); H01L 35/16 (2006.01); H01L 35/18 (2006.01); H01L 35/30 (2006.01);
U.S. Cl.
CPC ...
H01L 35/32 (2013.01); H01L 35/16 (2013.01); H01L 35/18 (2013.01); H01L 35/30 (2013.01);
Abstract

A thermoelectric conversion element that can efficiently make a temperature difference across a thermoelectric conversion material is provided. In the thermoelectric conversion element, on a first surface of a thermoelectric conversion module comprising a P-type thermoelectric element, an N-type thermoelectric element, and an electrode, a thermally conductive resin layer A and a thermally conductive resin layer B having a lower thermal conductivity than the thermally conductive resin layer A are provided in an alternating manner so as to be in direct contact with the first surface, and on a second surface on the opposite side of the first surface of the thermoelectric conversion module, a thermally conductive resin layer a and a thermally conductive resin layer b having a lower thermal conductivity than the thermally conductive resin layer a are provided in an alternating manner so as to be in direct contact with the second surface.


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