The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2017
Filed:
Dec. 16, 2016
Applicant:
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano-ken, JP;
Inventors:
Tomoo Yamasaki, Nagano, JP;
Kazuhiro Fujita, Nagano, JP;
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 21/306 (2006.01); H01L 21/308 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/528 (2013.01); H01L 21/02178 (2013.01); H01L 21/02274 (2013.01); H01L 21/308 (2013.01); H01L 21/30604 (2013.01); H01L 21/76852 (2013.01); H01L 23/53228 (2013.01); H01L 23/53233 (2013.01);
Abstract
A wiring substrate includes a first insulation layer, a wiring layer formed on an upper surface of the first insulation layer, a barrier film that covers the upper surface of the first insulation layer, an upper surface of the wiring layer, and side surfaces of the wiring layer, and a second insulation layer that covers an upper surface of the barrier film and side surfaces of the barrier film. The barrier film is an alumina film containing carbon atoms, and the alumina film has a carbon atom content rate that is in the range of 0.2 atomic % to 3.6 atomic %.