The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2017

Filed:

Jul. 02, 2012
Applicants:

Hisayuki Imamura, Kitakyushu, JP;

Suguru Fujita, Kitakyushu, JP;

Junichi Watanabe, Kitakyushu, JP;

Inventors:

Hisayuki Imamura, Kitakyushu, JP;

Suguru Fujita, Kitakyushu, JP;

Junichi Watanabe, Kitakyushu, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); B23K 35/30 (2006.01); B22F 7/06 (2006.01); B23K 35/36 (2006.01); B23K 35/02 (2006.01); C22C 1/04 (2006.01); C22C 5/06 (2006.01); C22C 5/08 (2006.01); C04B 37/02 (2006.01); H01L 23/15 (2006.01); H01L 23/373 (2006.01); B22F 9/02 (2006.01); B23K 101/40 (2006.01); H05K 1/03 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01); B22F 7/062 (2013.01); B23K 35/025 (2013.01); B23K 35/0244 (2013.01); B23K 35/3006 (2013.01); B23K 35/36 (2013.01); C04B 37/026 (2013.01); C22C 1/0466 (2013.01); C22C 5/06 (2013.01); C22C 5/08 (2013.01); H01L 23/15 (2013.01); H01L 23/3735 (2013.01); B22F 9/023 (2013.01); B23K 2201/40 (2013.01); C04B 2235/6562 (2013.01); C04B 2235/6565 (2013.01); C04B 2235/6567 (2013.01); C04B 2235/6581 (2013.01); C04B 2235/96 (2013.01); C04B 2237/125 (2013.01); C04B 2237/126 (2013.01); C04B 2237/127 (2013.01); C04B 2237/128 (2013.01); C04B 2237/343 (2013.01); C04B 2237/366 (2013.01); C04B 2237/368 (2013.01); C04B 2237/407 (2013.01); C04B 2237/597 (2013.01); C04B 2237/704 (2013.01); C04B 2237/706 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0306 (2013.01); H05K 3/38 (2013.01); Y10T 428/12014 (2015.01); Y10T 428/249969 (2015.04);
Abstract

To provide a brazing material for maintaining bonding strength between ceramic substrate and metal plate at a conventionally attainable level, while addition amount of In is reduced, and a brazing material paste using the same. A mixture powder provided by mixing alloy powder composed of Ag, In, and Cu, Ag powder, and active metal hydride powder, the mixture powder containing active metal hydride powder with a 10-to-25-μm equivalent circle average particle diameter by 0.5 to 5.0 mass %, the equivalent circle average particle diameters for the alloy powder, Ag powder, and active metal hydride powder having a relationship: alloy powder≧active metal hydride powder>Ag powder, and the powder mixture having a particle size distribution of d10 of 3 to 10 μm, d50 of 10 to 35 μm, and d90 of 30 to 50 μm, and in the frequency distribution, a peak of the distribution existing between d50 and d90.


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