The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2017
Filed:
Aug. 07, 2015
Unimicron Technology Corp., Taoyuan, TW;
Unimicron Technology Corp., Taoyuan, TW;
Abstract
A circuit board including a substrate, a photo imageable dielectric layer and a plurality of conductive bumps is provided. The substrate has a first surface and a first circuit layer, wherein the first surface has a chip disposing area and an electrical connection area, and the first circuit layer is embedded in the first surface. The photo imageable dielectric layer is disposed on the electrical connection area and has a plurality of openings, wherein parts of the first circuit layer is exposed by the openings. The conductive bumps are disposed at the openings respectively and connected to the first circuit layer, wherein a side surface of each of the conductive bumps is at least partially covered by the photo imageable dielectric layer. In addition, a manufacturing method of the circuit board is also provided.