The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2017
Filed:
Sep. 30, 2016
Applicant:
Ams Ag, Unterpremstaetten, AT;
Inventors:
Assignee:
ams AG, Unterpremstaetten, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 23/552 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 23/5283 (2013.01); H01L 23/53295 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 23/552 (2013.01); H01L 25/0657 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/10125 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/131 (2013.01); H01L 2224/136 (2013.01); H01L 2224/1319 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/13027 (2013.01); H01L 2224/13028 (2013.01); H01L 2224/1357 (2013.01); H01L 2224/13561 (2013.01); H01L 2224/1613 (2013.01); H01L 2224/16106 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/30101 (2013.01);
Abstract
A semiconductor substrate is provided with a through-substrate via comprising a metallization and an opening. A solder ball is placed on the opening. A reflow of the solder ball is performed in such a way that the solder ball closes the through-substrate via and leaves a void in the through-substrate via.