The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 2017

Filed:

Jun. 22, 2016
Applicant:

The Regents of the University of California, Oakland, CA (US);

Inventors:

Casey O. Holder, Goleta, CA (US);

Daniel F. Feezell, Albuquerque, NM (US);

Steven P. DenBaars, Goleta, CA (US);

Shuji Nakamura, Santa Barbara, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 29/20 (2006.01); H01L 21/02 (2006.01); H01L 21/3063 (2006.01); H01S 5/02 (2006.01); H01S 5/183 (2006.01); H01S 5/343 (2006.01); B82Y 20/00 (2011.01); H01L 21/306 (2006.01); H01L 31/0304 (2006.01); H01L 31/18 (2006.01); H01L 33/00 (2010.01); H01L 33/32 (2010.01); H01S 5/187 (2006.01); H01S 5/20 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7813 (2013.01); B82Y 20/00 (2013.01); H01L 21/0254 (2013.01); H01L 21/02389 (2013.01); H01L 21/02458 (2013.01); H01L 21/02664 (2013.01); H01L 21/30612 (2013.01); H01L 21/30635 (2013.01); H01L 29/2003 (2013.01); H01L 31/03044 (2013.01); H01L 31/1856 (2013.01); H01L 31/1892 (2013.01); H01L 33/0075 (2013.01); H01L 33/0079 (2013.01); H01L 33/32 (2013.01); H01S 5/0217 (2013.01); H01S 5/183 (2013.01); H01S 5/187 (2013.01); H01S 5/18341 (2013.01); H01S 5/18347 (2013.01); H01S 5/34333 (2013.01); H01L 21/02658 (2013.01); H01S 5/2009 (2013.01); H01S 2304/04 (2013.01);
Abstract

A method for the reuse of gallium nitride (GaN) epitaxial substrates uses band-gap-selective photoelectrochemical (PEC) etching to remove one or more epitaxial layers from bulk or free-standing GaN substrates without damaging the substrate, allowing the substrate to be reused for further growth of additional epitaxial layers. The method facilitates a significant cost reduction in device production by permitting the reuse of expensive bulk or free-standing GaN substrates.


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