The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 2017

Filed:

Feb. 14, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Ludovic Godet, Sunnyvale, CA (US);

Srinivas D. Nemani, Sunnyvale, CA (US);

Erica Chen, Cupertino, CA (US);

Jun Xue, San Jose, CA (US);

Ellie Y. Yieh, San Jose, CA (US);

Gary E. Dickerson, Gloucester, MA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/033 (2006.01); H01L 27/088 (2006.01); H01L 27/092 (2006.01); H01L 29/78 (2006.01); H01L 21/3105 (2006.01); H01L 27/108 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0337 (2013.01); H01L 21/0332 (2013.01); H01L 21/0335 (2013.01); H01L 21/3105 (2013.01); H01L 27/0886 (2013.01); H01L 27/0924 (2013.01); H01L 27/10879 (2013.01); H01L 27/1211 (2013.01); H01L 29/7831 (2013.01);
Abstract

Embodiments of the present disclosure relate to precision material modification of three dimensional (3D) features or advanced processing techniques. Directional ion implantation methods are utilized to selectively modify desired regions of a material layer to improve etch characteristics of the modified material. For example, a modified region of a material layer may exhibit improved etch selectivity relative to an unmodified region of the material layer. Methods described herein are useful for manufacturing 3D hardmasks which may be advantageously utilized in various integration schemes, such as fin isolation and gate-all-around, among others. Multiple directional ion implantation processes may also be utilized to form dopant gradient profiles within a modified layer to further influence etching processes.


Find Patent Forward Citations

Loading…