The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 2017

Filed:

Feb. 10, 2015
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Lena Nicolaides, Castro Valley, CA (US);

Mohan Mahadevan, Santa Clara, CA (US);

Alex Salnik, San Bruno, CA (US);

Scott A. Young, Soquel, CA (US);

Assignee:

KLA-Tencor Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/00 (2006.01); G01B 11/30 (2006.01); G01N 21/95 (2006.01); G01N 21/17 (2006.01); G01N 21/88 (2006.01);
U.S. Cl.
CPC ...
G01N 21/9505 (2013.01); G01N 21/1717 (2013.01); G01N 2021/8825 (2013.01); G01N 2201/06113 (2013.01);
Abstract

Disclosed are methods and apparatus for detecting defects or reviewing defects in a semiconductor sample. The system has a brightfield (BF) module for directing a BF illumination beam onto a sample and detecting an output beam reflected from the sample in response to the BF illumination beam. The system has a modulated optical reflectance (MOR) module for directing a pump and probe beam to the sample and detecting a MOR output beam from the probe spot in response to the pump beam and the probe beam. The system includes a processor for analyzing the BF output beam from a plurality of BF spots to detect defects on a surface or near the surface of the sample and analyzing the MOR output beam from a plurality of probe spots to detect defects that are below the surface of the sample.


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