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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9771479 B1

PDFFull Text
Date of Patent:
Sep. 26, 2017

Filed:

Mar. 21, 2014

Halogen-free resin composition and use thereof

Applicant:

Shengyi Technology Co., Ltd., Dongguan, CN;

Inventors:

Hu Yang, Dongguan, CN;

Yueshan He, Dongguan, CN;

Assignee:

SHENGYI TECHNOLOGY CO., LTD., , CN;

Attorney:

McDonald Hopkins LLC

Primary Examiner:

Terressa Boykin

Int. Cl.
CPC ...
B32B 15/04 (2006.01); C08L 79/04 (2006.01); C08K 3/00 (2006.01); C08K 5/49 (2006.01); C08L 25/10 (2006.01); C08L 71/12 (2006.01); C09D 179/04 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); B32B 15/098 (2006.01); B32B 15/20 (2006.01); C08G 14/06 (2006.01); C08G 14/12 (2006.01); C09J 161/34 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01); B32B 7/10 (2006.01); B32B 15/14 (2006.01); B32B 15/18 (2006.01); B32B 15/08 (2006.01);
U.S. Cl.
CPC ...
C08L 79/04 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 5/26 (2013.01); B32B 7/10 (2013.01); B32B 15/098 (2013.01); B32B 15/14 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); C08G 14/06 (2013.01); C08G 14/12 (2013.01); C08K 3/00 (2013.01); C08K 5/49 (2013.01); C08L 25/10 (2013.01); C08L 71/12 (2013.01); C09D 179/04 (2013.01); C09J 161/34 (2013.01); H05K 1/0298 (2013.01); H05K 1/0373 (2013.01); H05K 1/09 (2013.01); B32B 2260/021 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2262/10 (2013.01); B32B 2262/101 (2013.01); B32B 2264/102 (2013.01); B32B 2307/204 (2013.01); B32B 2307/306 (2013.01); B32B 2307/732 (2013.01); B32B 2457/08 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0355 (2013.01);
Abstract

The present invention relates to a halogen-free resin composition, a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises, based on the weight parts of organic solids, (A) from 40 to 80 parts by weight of allyl-modified benzoxazine resin, (B) from 10 to 20 parts by weight of hydrocarbon resin, (C) from 10 to 40 parts by weight of allyl-modified polyphenyl ether resin, (D) from 10 to 20 parts by weight of allyl-modified bismaleimide resin, (E) from 0.01 to 3 parts by weight of an initiator, (F) from 10 to 100 parts by weight of a filler, and (G) from 0 to 80 parts by weight of a phosphorus-containing flame retardant. The prepreg and laminate prepared from the halogen-free resin composition have lower dielectric constant and dielectric loss tangent value, higher peel strength, high glass transition temperature, excellent thermal resistance and better flame retardant effect.

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